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| CHA2411-QDG RoHS COMPLIANT 20-25GHz LNA GaAs Monolithic Microwave IC In QFN package Description The CHA2411 is a monolithic Low noise Amplifier in K band providing 26 dB gain from a single bias supply +5V with a noise figure of 2.5 dB. All the active devices are self biased on chip. The circuit is manufactured with a standard GaAs PHEMT process: 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. The chip is delivered in a 24 Leads RoHS compliant QFN4x4 package. Functional diagram Main Features n n n n n * Excellent noise figure : 2.5 dB Stable gain vs temperature 26 2dB Single supply : +5V Devices self biased on chip Standard SMD package : QFN 24L 4x4 Plastic Package Main Characteristics in QFN package Tamb = +25C Parameters Frequency range Small signal Gain SSB Noise figure Input / Output Return Loss Min 20 22 26 2.5 15 Typ Max 25 30 Unit GHz dB dB dB ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions ! Ref. : DSCHA2411QDG6174 - 23 Jun 06 1/10 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Departementale 128 - B.P.46 - 91401 Orsay Cedex France Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG Electrical Characteristics Full temperature range Symbol/Pins Frequency range Small signal Gain Gain variation over frequency Gain variation over temperature SSB Noise figure Input / Output Return Loss (20 to 23GHz) Input Power at 1 dB Gain Compression @24GHz Input IP3 @24GHz Saturated Output Power @24GHz +Vd, +Vg +I Top Supply Voltage Supply Current Operating temperature range -40 Parameters Min 20 22 26 0.5 2 2.5 15 -14 -7.5 13.5 5 43 25 55 100 15 Typ Max 25 30 Unit GHz dB dB dB dB dB dBm dBm dBm V mA C Remark : These performance has been obtained with the chip in QFN package mounted on the recommended boards (ref. 95541 & 95581) described in the document. These performance are highly dependent on this environment. Absolute Maximum Ratings (1) Symbol +Vg, +Vd +I Pin Top Tstg Parameters Maximum positive supply voltage Maximum positive supply voltage Maximum peak input power overdrive Operating temperature range (2) Storage temperature range Values 6 65 -5 -40 to +100 -55 to +125 Unit V mA dBm C C (1) Operation of this device above anyone of these parameters may cause permanent damage. Duration < 1s (2) Temperature of the back side of the QFN. Thermal resistance is RTh=195C/W Ref. : DSCHA2411QDG6174 - 23 Jun 06 2/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG Typical QFN measurements on board 95581 (QFN plan) Typical Sij Parameters vs Frequency in the QFN package plans 35 30 25 20 15 S21(dB) S11(dB) S22(dB) Sij (dB) 10 5 0 -5 -10 -15 -20 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Frequency (GHz) Ref. : DSCHA2411QDG6174 - 23 Jun 06 3/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG Typical QFN measurements on board 95541 (QFN plan) Noise Figure vs Frequency 4 3,8 3,6 3,4 3,2 3 2,8 2,6 2,4 2,2 2 1,8 1,6 1,4 1,2 1 22 22,5 23 23,5 24 24,5 100C NF (dB) 25C -40C 25 25,5 26 Frequency (GHz) Gain vs Frequency 30 28 26 24 Gain (dB) 22 20 18 16 14 12 10 16 17 18 19 20 21 22 23 24 25 26 Frequency (GHz) 25C -40C 100C Ref. : DSCHA2411QDG6174 - 23 Jun 06 4/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG QFN Outline Ref. : DSCHA2411QDG6174 - 23 Jun 06 5/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG Pin-out description Pin number 4 15 22 9 3, 5, 14, 16 1, 2, 6, 7, 8, 10, 11, 12, 13, 17, 18, 19, 20, 21, 23, 24 Pin name RFIn RFOut VD VG GND Nc Symbol Name RF_IN RF_OUT +Vd +Vg Control Voltage port RF1 Input/Output ports Positive Drain supply voltage Positive Gate supply voltage Ground Not connected Description External Components and bias configuration (recommended) 19 18 17 16 15 14 13 12 20 21 22 23 24 1 2 3 4 5 6 11 10 9 8 7 Ref. : DSCHA2411QDG6174 - 23 Jun 06 6/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG Recommended Test Fixture (Ref. 95541) for measurements over Temperature Range Ref. : DSCHA2411QDG6174 - 23 Jun 06 7/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG Recommended Test Fixture (Ref. 95581) for measurements in the package's plans with probes Ref. : DSCHA2411QDG6174 - 23 Jun 06 8/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG ESD sensitivity Norm MIL-STD-1686C ESD STM5.1-1998 Value HBM Class 1 (<1000V) HBM Class 0 (<250V) Package Information Parameter Package body material Lead finish MSL Rating RoHS-compliant Low stress Injection Molded Plastic 100% matte Sn MSL1 Recommended surface mount package assembly (see UMS AN0017) For volume production the SMD type package can be treated as a standard surface mount component (please refer to the IPC/JEDEC J -STD-020C standard or equivalent). The assembly on the motherboard can be performed using a standard assembly process (e.g. stencil solder printing, standard pick-and-place machinery, and solder reflow oven). However, caution should be taken to perform a good and reliable contact over the whole pad area. MAXIMUM RECOMMENDED REFLOW PROFILE for LEADFREE SMT ASSEMBLY PRODUCTS 300 280 260 240 217 220 200 Temperature (C) 180 160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120 140 160 180 Time (s) 200 220 240 260 280 300 320 340 360 Maximum Ramp up rate : 3C / second 30s Max 150 255 Attention: The solder thickness after reflow should be typical 50m [2 mils] and the lateral alignment between the package and the motherboard should be within 50m [2 mils]. It is important for the performance of the product that the whole overlapping area between the motherboard and package pads is connected. Voids or other improper connections, in particular, between the ground pads on motherboard and package will lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the product. Ref. : DSCHA2411QDG6174 - 23 Jun 06 9/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 K-band LNA CHA2411-QDG Ordering Information 24L-QFN4x4 Lead Free Package : Stick: XY=20 Tape and reel: XY=21 CHA2411-QDG/XY Information furnished is believed to be accurate and reliable. However United Monolithic Semi conductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHA2411QDG6174 - 23 Jun 06 10/10 Specifications subject to change without notice Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 |
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